基于Moldflow解决LED灯罩的开裂问题

Solve the Cracking Problem of LED Lampshade Based on Moldflow

运用Moldflow软件对LED灯罩的注塑过程进行模流分析,得到其填充分析结果。LED灯罩无法通过冲击锤测试,在灯罩面随意冲击发生开裂。通过模流分析发现这是由于结构原因:当顶面壁厚比边壁厚薄时,拐角处厚度太大,形成跑道效应,在灯罩面上形成熔接线,冲击时就会在熔接线位置发生开裂。通过改变制件厚度,解决了灯罩面的熔接线,灯罩面冲击测试完全通过。

Moldflow software was used to analyze the injection process of light emitting diode(LED)lampshade,and the filling analysis results were obtained.LED lampshade could not pass the test of impact hammer,and the random impact on the lampshade surface could occur cracking.Through the moldflow analysis could find that this is caused by the structural reasons.When the top surface thickness is lower than the side surface thickness,the thickness of the corner is too large,which could form the runway effect.And then the weld lines are generated on the top surface of the lamp shade.During the impact,the welding line will crack at welding line position.By changing the thickness of the parts,the weld line cracking problem of the lampshade could be solved,and the lampshade could pass the impact test completely.