摘要
石墨烯无机填充物以原位聚合方式与聚酰胺酸基体进行聚合反应,在相界面处形成化学键,采用逐步升温固化制得聚酰亚胺复合薄膜。通过对不同填充物含量复合薄膜的结构、微观形貌、热稳定性、力学性能及导电性进行实验分析,结果表明:当w(石墨烯)=1. 0%时,复合PI薄膜具有优异的综合性能。
The graphene inorganic filler was polymerized with PAA by in situ polymerization and formed chemical bonds at the phase interface. Graphene and polyimide composite film was made using gradual temperature curing. The research results show that graphene and polyimide composite film had excellent comprehensive performance when w (graphene) was 1.0% in PI through analysis of the structure, microstructure, thermal stability, mechanical properties and electrical conductivity.
作者
赵斯梅
ZHAO Si-mei(Yancheng Institute of Industry Technology, Yancheng 224005, China)
出处
《玻璃钢／复合材料》
CAS
北大核心
2019年第4期43-46,共4页
Fiber Reinforced Plastics/Composites
基金
国家自然科学基金重点项目(50137010)
国家自然科学资助项目(50373008)
关键词
聚酰亚胺
石墨烯
热稳定性
导电性
力学性能
PI
graphene
thermal stability
mechanical properties
electrical conductivity
