摘要
本文重点研究了红外LED芯片断裂的失效现象,通过扫描电子显微镜(SEM)排查芯片是否存在暗裂,通过DSC测试发现失效品的环氧树脂存在固化不充分的问题,从而找到了产品失效的根本原因。
This paper focuses on the failure of infrared LED chips. Scanning electron microscopy (SEM) is used to check whether there are dark cracks in the chips. DSC tests show that there are insufficient curing of epoxy resin in the failed products, and the root causes of product failure are found.
作者
叶小辉
Ye Xiaohui(Xiamen Hualian Electronics Co.,Ltd.,Xiamen Fujian,361000)
出处
《电子测试》
2019年第8期53-54,共2页
Electronic Test
