脉冲负偏压对直流磁控溅射碳膜结构和性能的影响

Influence of pulsed negative bias on structure and properties of carbon films grown by magnetron sputtering

通过直流磁控溅射技术在基体(硅片、高速钢、钢片)上沉积碳膜。保持其它工艺参数基本恒定,探究薄膜在100V-400V脉冲负偏压下,结构和性能的变化规律。实验结果表明,这种碳膜为非晶态硬质薄膜,具有较好表面形貌,且随着脉冲偏压数值的逐渐增加,其厚度、沉积速率和硬度均呈现先增大后减小的趋势,而摩擦系数则先减小后增大。当脉冲负偏压为200 V时,薄膜具有最佳的力学性能。

Carbon films were deposited on different substrates, such as silicon, high-speed steel and stainless steel, by magnetron sputtering. Keeping other parameters constant, the pulsed negative bias varying from 100 V to 400 V was applied to the substrate in order to investigate the change of micro-structure and performance of the carbon films. The results show that all the as-deposited carbon films are amorphous and hard with good surface quality. The hardness, thickness as well as deposition rate of the carbon films increase initially and then decrease with increasing pulsed bias, while the friction coefficient behaves oppositely. The optimized mechanical properties of the carbon films are obtained at the pulsed negative bias of 200 V.