低温烧结LED基板用Ca-Ba-Mg-Al-B-Si-O玻璃/Al_2O_3材料的性能研究

Study on Properties of Ca-Ba-Mg-Al-B-Si-O Glass/Al_2O_3 Material for Low-Temperature Sintered LED Substrate

实验以Ca-Ba-Mg-Al-B-Si-O玻璃与Al_2O_3粉料为原料,设计玻璃与Al_2O_3粉料复合的质量比分别为60∶40、55∶45、50∶50、45∶55,采用低温烧结法制备LED基板材料。研究结果表明:随着Al_2O_3含量(质量分数)增加,样品的烧成收缩率与热导率先增加后减小。添加45%Al_2O_3的玻璃/Al_2O_3材料于875℃烧结良好,试样烧成收缩率为12.82%,体积密度为3.10 kg/L,10 MHz下介电常数为8.03,介电损耗为0.000 7,热导率为2.89 W/(m·K)。高温下Ca^(2+)离子、Al^(3+)离子、Si^(4+)离子与O^(2-)离子聚集在一起发生了化学反应,形成了CaAl_2Si_2O_8晶体。玻璃/Al_2O_3烧结材料的主晶相为玻璃、氧化铝、钙长石,SEM显示烧结体微观结构致密。因此该体系材料比较适合用作低温烧结LED基板材料。

LED substrate materials are prepared with Ca-Ba-Mg-Al-B-Si-O glass and Al2O3 ceramic as the raw materials at different mass ratios of 60 ∶ 40,55 ∶ 45,50 ∶ 50,45 ∶ 55.Glass/ceramic system LED substrate materials are prepared by low-temperature sintering method.The results show that the shrinkage of samples increase first,and then decreases with the increasing of Al2O3 content.The glass/Al2O3 material with 45% Al2O3 sinters better at 875 ℃.In addition,the composite material hassintered shrinkage of 12.82%,bulk density of3.10 kg/L,dielectric constant of 8.03,dielectric loss of 0.000 7 (at 10 MHz),and thermal conductivity of 2.89 W/(m·K).At high temperature,a chemical reaction occurs with Ca2+ ions,Al3+ ions,Si4+ ions,and O2- ions gathered together,and then CaAl 2Si 2O 8 crystal forms.The main crystalline phases of glass/Al2O3 sintered material are glass,alumina and anorthite.SEM shows that the microstructure of sintered body is compact.And that suggests a good application for the low temperature fired LED substrate materials.