摘要
以Cu-8Sn-0.3P合金(Sn质量分数为8.5%)为研究对象,研究了均匀化退火工艺、中间退火工艺和低温退火工艺对该合金组织性能的影响。研究结果表明,Cu-8Sn-0.3P合金适合的均匀化退火温度范围为600～680℃(6～8 h),中间退火温度应控制在500～550℃(2 h),合金经低温退火,带材的延伸率可达10%以上。
Taking Cu-8 Sn-0.3 P alloy(The mass fraction of Sn is 8.5%) as a study object, the paper studies the effects of homogenizing annealing process, intermediate annealing process and low temperature annealing process on the structure property of this alloy. The results show that the temperature of homogenizing annealing process suitable for Cu-8 Sn-0.3 P alloy ranges between600~680 ℃( annealing time 6~8 h). the temperature of intermediate annealing should be controlled in 500~550 ℃(2 h). The elongation of strips can reach more than 10% after low temperature annealing.
作者
谢鹭
XIE Lu(Mechanical and Electronic Engineering School,Nanchang University, Nanchang, Jiangxi 330031, China)
出处
《有色冶金设计与研究》
2019年第2期32-35,共4页
Nonferrous Metals Engineering & Research
