摘要
针对PCB工艺中产品表面的微观粗糙度情况(颗粒粒径小于5μm),选择样品,通过将LSCM测量结果与样品的真实表面形貌(SEM的观察结果)的比较以及不同测试条件测量出的结果之间的比较,找到合适的测试条件和粗糙度指标来准确显著地测量微观粗糙度和反映微观情况。
In view of the roughness of product surface in PCB process (particle size less than 5 μm), samples are selected. By comparing the LSCM measurement results with the real surface morphology (SEM observation results) and the results measured under different test conditions, suitable test conditions and roughness indexes are found to accurately and significantly measure roughness and reflect microscopic situation..
作者
方军良
FANG Junliang(Shanghai Meadville Science and Technology Co.,Ltd.,Shanghai 201613,China)
出处
《电子工艺技术》
2019年第2期77-80,115,共5页
Electronics Process Technology