FG+纳米涂层印刷钢网开孔面积比设计

Design Rules for Opening Area Ratio of FG + Nano-coating Printing Stencil

SMT印刷钢网制作工艺有化学蚀刻、激光切割加电抛光和电铸成型工艺,但由于印刷效果差或制造成本高而难以满足目前精密印刷的生产需求。FG+纳米涂层印刷钢网采用FG钢片激光切割加电抛光之后增加纳米涂层工艺,该钢网印刷能力好,且具有较好的印刷转移率。主要介绍了FG+纳米涂层印刷钢网的特点,研究了这种钢网开孔面积比与锡膏印刷转移率和印刷高度之间的关系,找出满足锡膏印刷要求的最小面积比,形成FG+纳米涂层钢网的开孔设计规则,为此类印刷钢网设计提供参考。

The manufacturing processes of SMT printing stencil in the electronics industry include chemical etching, laser cutting and electro-polished, and electroforming process, but it is difficult to meet the current production needs of precision printing due to poor printing effect or high manufacturing costs. FG+ nano-coating printing stencil adopts FG steel sheet laser cutting and electropolishing to add nano-coating process.This stencil has good printing ability and good printing transfer rate. Mainly introduce the characteristics of FG+nano- coating printing stencil, research the relationship between the opening area ratio of the printing stencil and the transfer rate and height of solder paste printing, finds out the minimum area ratio to meet the requirements of solder paste printing, and form the design rules of openings of FG+nano- coating printing stencil, which can provide reference for design of such printing stencil.