异形结构盒体封装封焊的工艺优化

Optimization of Seam Soldering Technology for Special Structure Boxes

利用90°固定角度工作平台的平行封焊设备实现了对八边形异形结构盒体的封装。研究了封焊设备的电极宽度和角度、封焊轨迹的选择、封焊工艺参数的优化及焊缝宽度的控制对封装后的焊缝形态、盒体气密性和内部多余物等方面的影响。结果表明,通过改变设备电极尺寸,采用圆形封焊轨迹及优化工艺参数后,实现了对八边形异形盒体的平行缝焊。封焊后产品的气密性和粒子碰撞噪声检测合格率分别达到100%和95%。该封焊方法打破了90°固定角度平行缝焊机只能封装矩形和圆形盒体的固有认知,适合小批量多型号混合集成电路的封装。为实现低成本的多边形异形盒体的平行缝焊提供了思路和实践支撑,满足了工业生产要求。

The packaging of the octagonal shaped boxes is realized by using the parallel sealing equipment of the 90o fixed angle working platform. The effects of the electrode width and angle of sealing soldering equipment, the selection of sealing soldering track, the optimization of sealing soldering process parameters and the control of soldering width on the solder shape, the air tightness of the box and the internal surplus after packaging are studied. The results show that the parallel seam soldering of octagonal special-shaped box can be realized by changing the electrode size of the equipment, adopting the circular seal soldering track and optimizing the process parameters. After sealing soldering, the test qualified rate of airtightness and PIND test is 100% and 95% respectively. The sealing soldering method has broken the inherent cognition that parallel seam soldering machine with 90o fixed angle can only encapsulate rectangular and circular boxes, which is suitable for the package of small batch multi-model hybrid circuits. It provides the ideas and practical support for the parallel seam soldering of the polygonal box with low cost, and meets the requirements of industrial production.