波峰焊接常见不良情况及改进措施

Common Defects and Improvement Measures of Wave Soldering

波峰焊接工艺比再流焊接工艺复杂很多,影响因素不限于设备本身,更大程度上是受设计的影响。简要介绍了波峰焊接工艺的原理及常见的两个主要不良现象(桥连和透锡不足),及其产生原因和改善方向。实践表明,只要在产品工艺设计时给与重视,桥连与透锡不良是可以有效解决的,特别是透锡不足的问题可以100%地给与解决。

Wave soldering process is much more complicated than reflow soldering process. The influence factors are not limited to the equipment itself, but to a greater extent, the design. The principle of wave soldering and the causes of two main defects(bridge connection and insufficient solder), and the improvement directions are briefly introduced. Practice shows that as long as attention is paid to the product process design, the problem of bridging and insufficient solder can be effectively solved, especially the problem of insufficient solder can be solved 100%.