新型电子箱散热性能仿真分析

Simulation Analysis of New Electronic Box Thermal Dissipation Performance

为得到一种散热效果较好的电子箱,运用CFD数值模拟从结构和风机流量两个方面对电子箱进行了设计优化。首先通过仿真对比选择带有折流板的新型电子箱,该结构的箱体相较于无折流板的箱体散热性能好;其次综合考虑电子箱工作性质、节能、经济等因素,为该箱体选用散热流量为300m^3·h^(-1)的风机;最后用实验验证了仿真数据的准确性,为电子箱散热性能的研究提供了数据支持与理论依据,同时为电子箱结构的放大和实际运用奠定了基础。

In order to obtain an electronic box with good thermal dissipation effect, we use CFD numerical simulation to optimize the design of the electronic box from two aspects of structure and fan flow. Firstly, a new type of electronic box with baffles is selected through simulation. The box of this structure has better thermal dissipation performance than the box without baffles. Secondly, considering the working nature of the electronic box, energy saving, economy and other factors, we select the fan with a heat dissipation rate of 300 m^ 3·h^-1 for the box;the accuracy of the simulation data was verified experimentally in the end, which provided data support and theoretical basis for the research on the heat dissipation performance of the electronic box, and laid the foundation for the amplification and practical application of the electronic box structure.