摘要
LTCC基板生产中,生瓷片的形变将影响叠片时通孔以及印刷图形的对位精度。本文着重对填孔,整平,印刷工序进行分析,通过对同层的多张生瓷片进行精度测量,获得生瓷片偏差数据,结合以上三道工序的生产技术特点,进行综合分析,研究影响生瓷片形变的因素。在生产过程中,根据形变量对精度进行补偿,提高了叠片精度。
During the production of LTCC bases,the tapes deformation will affect the through hole of laminated sheet and the alignment accuracy of printing pattern.This paper main analyses on via-filling,leveling and printing process,and gets tapes offset data,then comprehensive analyses are made combined with the characters of three processes above.Finally it studies out the factors of tape precision.During production,precision compensation based on analysis of tape deformation can improve the lamination precision.
作者
杨伟
马其琪
贾少雄
Yang Wei;Ma Qiqi;Jia Shaoxiong(Micropackage Center,The 2rd Research Institute of China Electronics Technology GroupCorporation,Taiyuan Shanxi 030024,China)
出处
《山西电子技术》
2019年第2期27-29,78,共4页
Shanxi Electronic Technology
