摘要
随着光刻图形尺寸越来越小,缺陷(任何对目标图形的偏离)对产品良率影响越来越大。在各种各样的缺陷产生原因中,显影缺陷是影响产品良率的一种主要的缺陷来源。本文通过对T map缺陷所经过涂胶与显影单元次数分析,在仔细研究显影单元构造,推论出显影nozzle回到起始位置过程中,显影液偷滴到所经过显影单元内正在旋干的spin wafer上造成了T map缺陷,并通过实验验证了推论结论。在明确成因的基础上,进一步给出了显影nozzle回吸调整方法,避免了T map再次发生造成的产品报废,给行业内解决同类缺陷提供了参考。
along with the smaller critical dimension(CD),defect(any deviation with target pattern)is a key impact to product yield.Among the different reason of causing defect,the defect related with developing is a main type.Through analysis T map wafer passed the coating/developing unit counts,and the developing spin unit configuration,we infer that developing water dripping to spin wafer when developing nozzle go back to home position cause T map defect,experiments also support the conclusion.Based on the genetic mechanism,we give the optimized method of tuning suck back and avoid the T map defect.It also provides a reference for the industry to solve similar defects.
作者
秦利鹏
QIN Li-peng(Shanghai Huali Microelectronics Corporation,Shanghai 201203,China)
出处
《中国集成电路》
2019年第4期66-69,共4页
China lntegrated Circuit
关键词
光刻
缺陷
Tmap
回吸
Photolithography
defect
T map
suck back
