液相分散法制备低熔点Sn-Bi-In钎料合金粉的工艺研究

Study on Preparation Process of Low Melting Point Sn-Bi-In Solder Powder by Liquid Phase Dispersion Method

以十二烷基硫酸钠(SDS)为表面活性剂,聚乙烯基吡咯烷酮(PVP)为稳定剂,采用液相分散法,在N,N-二甲基甲酰胺(DMF)中制备了不同粒径的低熔点Sn-Bi-In钎料合金粉,并研究了钎料合金粉的粒径和形貌的主要影响因素。实验发现,搅拌时间和转速对钎料合金粉的粒径影响较大,而稳定剂对于合金粉的粒径和形貌也有显著影响。通过控制工艺条件,可得到粒径为1～10μm的钎料合金粉。运用SEM和XRF对钎料合金的形貌和成分进行了表征,并采用DSC方法分析了钎料合金粉的熔化温度区间。微米级Sn-Bi-In钎料合金粉配制的焊膏可用于微电子连接中电子元器件、引线和PCB电路板的连接与组装。

Low melting point Sn-Bi-In solder powders with different particle sizes were prepared by liquid phase dispersion method in N,N-dimethyl formamide(DMF),taking sodium dodecyl sulfate(SDS)as the surfactant,polyvinyl pyrrolidone(PVP)as the stabilizer.The main influence factors of particle size and morphology of solder powder were studied.It is found that the mixing time and revolving speed have great influence on the particle size of the solder alloy powder,and the stabilizer has a significant effect on the particle size and morphology of the alloy powder.By controlling the technological conditions,the solder powder with particle size of 1-10 μm can be obtained.The morphology and composition of solder alloy were characterized by SEM and XRF,and the melting temperature range of solder alloy powder was analyzed by DSC method.The solder paste prepared by the micron Sn-Bi-In solder powder can be used for the connection and assembly of electronic components,lead wires and PCB boards in microelectronic connections.