红外热成像的电子器件故障识别研究

Fault identification of electronic devices research by using infrared thermal imaging

电子器件故障的类型多,变化复杂,使得当前电子器件故障的识别正确率低、速度慢,为了改善电子器件故障识别的效果,提出了红外热成像的电子器件故障识别方法。首先对当前电子器件故障识别研究现状进行了分析,找到引起电子器件故障识别识别效果差的原因,然后采集电子器件状态的红外热图像,并提取电子器件故障识别特征,最后采用数据挖掘技术构建电子器件故障识别器,并与其它电子器件故障识别方法进行了仿真对比实验。结果表明,本文方法能够有效识别各种电子器件故障,电子器件故障的误识率低,电子器件故障的整体识别效果要优于对比方法,具有更加广泛的应用前景。

There are many types of electronic device faults and their changes are complex, which make the current electronic device fault identification accuracy and speed slow. In order to improve the effect of electronic device fault identification , the infrared thermal imaging method of electronic device fault identification is proposed. Firstly, the current status of electronic device fault identification is analyzed, and the reasons for the poor effect of electronic device fault identification are found. Then the infrared thermal image of electronic device state is collected, and the fault identification features of electronic device are extracted. Finally, the fault identifier of electronic device is constructed by data mining technology, and the electronic device is compared with it. The fault recognition method is simulated and compared. The results show that this method can identify all kinds of electronic device faults, the accuracy of electronic device fault identification is low, the overall recognition effect of electronic device faults is better than the com? parison method, and has a wider application prospect.