摘要
芳纶短纤维(AF)因具有高模量、耐高温以及耐化学稳定性等优异性能而得到广泛应用。然而,AF表面高度结晶且呈化学惰性导致制备的复合材料界面黏接较差,难以充分利用其优异性能。文中首先对AF进行热氧化处理,再使用CaCl_2乙醇溶液进行处理,最后用极性的丁吡胶乳浸渍处理得到改性浸胶预处理AF,重点研究了不同改性预处理方法对AF填充的三元乙丙橡胶(EPDM)界面黏合性能的影响。实验结果表明,AF经复合处理后所制备的复合材料性能提高显著,其100%定伸应力、横向撕裂强度和纵向撕裂强度比未改性AF制备的复合材料分别提高了50.00%、78.95%和52.35%,相对滑脱能提高205.83%。动态力学热分析仪(DMA)和扫描电镜(SEM)结果表明,复合处理AF制备的复合材料纤维与橡胶界面黏接最好。
Aramid fibers (AF) were widely used owing to its high modulus and strength, outstanding temperature resistance and chemical stability. However, the highly crystallinity and low active surface of AF leaded to the poor interfacial adhesion performance of preparing composites, outstanding performances of AF have not been fully utilized. In this paper, AF was firstly treated by thermal oxidation treatment and then treated with calcium chloride-ethanol solution;finally, the pre-treated AF was impregnated with polar butadiene vinyl-pyridine rubber latex. The influences of different modified pretreatment methods on interfacial adhesion properties of AF filled ethylene propylene diene monomer (EPDM) were investigated. The results show that EPDM which is reinforced with AF prepared by complex processing has the most significant improvement in performances, the stretching stress at 100%, lateral tear strength and longitudinal tear strength compared with composites prepared by untreated AF are increased by 50.00%, 78.95% and 52.35%, respectively. The relative slip energy increases by 205.83%. Dynamic thermal mechanical analyzer (DMA) and SEM results show that the composites prepared by complex processing AF have the best adhesion with the rubber matrix.
作者
李鹏
罗筑
钟金成
周宗淘
刘春利
Peng Li;Zhu Luo;Jincheng Zhong;Zongtao Zhou;Chunli Liu(School of Material and Metallurgy ,Guizhou University ,Gniyang 550025 ,China;Guizhou Province Engineering Laboratory for Rubber Composite ,Gniyang 550025 ,China)
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2019年第4期40-46,共7页
Polymer Materials Science & Engineering
基金
国家自然科学基金地区科学基金资助项目(51763004)
关键词
芳纶短纤维
三元乙丙橡胶
改性
界面黏合
热氧化处理
aramid short fiber
ethylene propylene diene monomer
modification
interface adhesion
thermal oxidation treatment