PEEK/SiC-BN导热复合材料的制备与性能

Preparation and Properties of Thermal Conductive PEEK/SiC-BN Composites

采用双螺杆挤出、模压成型的方法以聚醚醚酮(PEEK)为基体,零维粒状碳化硅(SiC)和二维片状氮化硼(BN)为导热填料制备了导热PEEK/SiC-BN复合材料,研究了SiC粒径对PEEK/SiC-BN复合材料的导热性能、结晶性能以及热稳定性的影响。结果表明,SiC和BN的加入使复合材料的导热性能和热稳定性得到显著的提高,且当SiC的粒径为5μm时,复合材料的导热系数达到最大为0.63 W/(m·K)。同时,复合材料的熔融温度、结晶温度以及结晶度随SiC和BN的加入有不同程度的降低。

Thermal conductive PEEK/SiC-BN composites were prepared by twinscrew extrusion melt blending and molding with polyether ether ketone (PEEK) as matrix, 0D silicon carbide (SiC) and 2D boron nitride (BN) as thermal conductive filler. The effects of the particle size of SiC on the thermal conductivity, crystallization properties and thermal stability of final composites were systematically investigated. The results show that the thermal conductivity and thermal stability of the composites were obviously improved with the addition of SiC and BN. When the diameter of SiC was 5 μm, the thermal conductivity of the composites reached the maximum of 0. 63 W/(m · K). At the same time, the melting temperature, crystallization temperature and crystallinity of the composites decreased at different degrees with the addition of SiC and BN.