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原子灰固化体系及固化温度的初探 被引量:2

Preliminary study on curing system and curing temperature of poly putty
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摘要 采用过氧化苯甲酰(BPO)和过氧化甲乙酮(MEKP)两种固化体系对原子灰(不饱和聚酯树脂)进行固化和差示扫描量热(DSC)测试,考察了原子灰的固化性能、固化程度以及低温敏感性。结果表明,在BPO–DMA(N,N-二甲基苯胺)体系中引入异辛酸钴[Co(Ⅱ)]后,原子灰的固化快,表干好,附着力优,温度敏感性低。当BPO–DMA–Co(Ⅱ)固化体系中促进剂DMA与Co(Ⅱ)的质量比为1∶1时,原子灰的固化过程放热快,转化率高,固化时间短,固化后的打磨性较佳。 An unsaturated polyester resin putty was cured by two curing systems,i.e.benzoyl peroxide(BPO)and methyl ethyl ketone peroxide(MEKP),and tested by differential scanning calorimetry(DSC).The curing performance,curing degree,and low-temperature sensitivity of the putty were examined.The results showed that the introduction of cobalt bis(2-ethylhexanoate),coded as Co(II),into the BPO DMA(N,N-dimethylaniline)system made the putty fast curing,good surface dryness,excellent adhesion,and less temperature sensitivity.The putty using a BPO DMA Co(II)curing system with a mass ratio of 1:1 for the promoters DMA and Co(II)had the following properties:fast heat release rate in the curing process,high conversion rate,short solidification time,and good polishability after being solidified.
作者 刘丽 刘欣伟 邢红立 刘方方 LIU Li;LIU Xin-wei;XING Hong-li;LIU Fang-fang(College of Chemical and Pharmaceutical Engineering,Hebei University of Science and Technology,Shijiazhuang 050018,China)
出处 《电镀与涂饰》 CAS CSCD 北大核心 2019年第8期380-385,共6页 Electroplating & Finishing
基金 河北省高等学校科学技术研究项目资助青年基金项目(QN2018142) 河北科技大学研究生创新资助项目
关键词 不饱和聚酯树脂 原子灰 过氧化苯甲酰 N N-二甲基苯胺 异辛酸钴 附着力 unsaturated polyester resin putty benzoyl peroxide dimethylaniline cobalt(II)bis(2-ethylhexanoate) adhesion
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