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X波段铁氧体微带环行器阵列封装设计与仿真 被引量:1

Package design and simulation of a ferrite microstrip circulator array applied at X-band frequency
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摘要 对一种新型的X波段瓦片式相控阵雷达中铁氧体微带环行器阵列(4×4)封装结构展开研究,设计了一种小体积、高密度的微带环行器阵列封装形式。基于HFSS三维仿真软件对该环行器阵列进行仿真,在满足其环行功能的同时,实现了环行器与天线和T/R组件的垂直互联。仿真结果表明,在8.7~12 GHz范围内,环行器阵列正向插入损耗(S12)小于0.52 dB,反向隔离度(S21)和回波损耗(S11)均大于20 dB。 A new structure of a X-band microstrip ferrite circulator array (4×4) for phased array radars is investigated.A circulator array package with small volume and high integration is designed.Based on the HFSS software,simulation and modeling of the circulator array are carried out.The circulator array behaves well in circulate function.The vertical interconnection of circulator,antenna and T/R module is implemented.The simulation results reveal that,at 8.7 to 12 GHz,the insertion loss (S12) is less than 0.52 dB and both the isolation degree (S21) and return loss (S11) are higher than 20 dB.
作者 陈永星 蒋晓娜 余忠 孙科 郭荣迪 兰中文 CHEN Yong-xing;JIANG Xiao-na;YU Zhong;SUN Ke;GUO Rong-di;LAN Zhong-wen(School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,China)
出处 《磁性材料及器件》 CAS CSCD 2019年第3期25-28,69,共5页 Journal of Magnetic Materials and Devices
关键词 铁氧体微带环行器 阵列化封装 垂直互联 仿真 ferrite microstrip circulator array package vertical interconnection simulation
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  • 1[1]Stimson G W.Introduction to airborne radar[M].2nd ed.NY:Scitech Publishing,1998.
  • 2[2]Brookner E.Phased arrays and radar-past,present and future[J].Microwave Journal,2006,49 (1):1-4.
  • 3[3]Hommel H,Feldle H.Current status of airborne active phased array (AESA) radar systems and future trends[C]//European Radar Conference.Holland:Amsterdam,2004.
  • 4[4]Michael P.Active electronically scanned arrays energize fighter performance[J].C4ISR Journal,2005:22-30.
  • 5刘青元,张芹,周卫.LTCC基板收缩率一致性控制工艺技术研究[J].电子元件与材料,2012,31(增刊):38-40.
  • 6Raymond L Brown, Paul W. Polinski Manufacturing of Microwave Modules using Low-temperature Co-fired Ceramics [J]. IEEE MTToS Digest 1994:1727-1730.
  • 7Christian Block, Peter Hagn, Christian Hoffmann, et alLTCC Technology for System in Package Solutions [J]. Silicon Monolithic Integrated Circuits in RF Systems, 2006, Digest of Papers. 2006:18-20.
  • 8F J Schmuckle, A Jentzsch, W Heinrich, J Butz, M. Spinnler LTCC as MCM Substrate: Design of Strip-Line Structures and Flip-Chip Interconnects [J]. 2001 IEEE MTT-S Digest, 2001:1903-1906.
  • 9Bonnet B, et al. 3D packaging technology for integrated antenna front-ends[C].38'h European Microwave Conference, 2008: 1569-1572.
  • 10Rainee N simons. Coplanar Waveguide Circuits, Components and Systems[M]. New York: Wiley inter- science, 2001.1-3.

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