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多种约束下大型矩形纺丝箱的热-固耦合分析

Thermosetting-coupling analysis of large rectangular spinning box under multiple constraints
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摘要 针对大型矩形纺丝箱体的热应力对支座处产生影响的问题,以某公司12位联苯气相加热大型纺丝箱体作为研究对象,对矩形纺丝箱整体结构进行 ANSYS 有限元分析,研究设置支架对纺丝箱支座处温度变化的影响规律,采用间接法考察其支座在不同种类约束下热-固耦合的热应力变化规律.结果表明:支座通过支架散热更快,支座区域存在较大的温度梯度;纺丝箱最大热应力出现在箱体支座的螺栓孔处,组件圈的温度梯度较小;在全约束下支座的热应力最大,当温度梯度小于10℃时,支座的热应力大小不受约束变化的影响.进行工程设计时,可选用隔热性能优良的保温材料,适当调节纺丝箱不同支座处的螺栓松紧性,有效降低热应力,保障设备安全运行. Aiming at the problem that the thermal stress of the large rectangular spinning box affects the support, taking the 12-bit biphenyl gas-phase heating large spinning box of a company as the research object, the ANSYS finite element analysis of the whole structure of the rectangular spinning box was carried out, the influence of the support on the temperature variation law of the support was studied, and the thermal stress variation of the support under different external constraints was analyzed. The results showed that the heat dissipation of the support through the support was faster than that in the air. Even if the insulation layer was added to the support and the support surface, there was still a large temperature gradient in the support area. For spinning box, the maximum thermal stress occured at the bolt hole of the box support, the thermal stress at the four corners of the pump seat was more obvious, and the temperature gradient of the spinning box assembly ring was smaller. When the temperature gradient was less than 10 ℃, the thermal stress of the support was not affected by the change of the constraint.When the engineering design apply, the material with good thermal insulation properties is selected and the ability of bolt tightness is adjusted properly in order to reduce thermal stress and ensure the safe operation of equipment.
作者 王垒智 董金善 孙存旭 WANG Leizhi;DONG Jinshan;SUN Cunxu(College of Mechanical and Power Engineering,Nanjing Tech University,Nanjing 211816, China)
出处 《轻工学报》 CAS 2019年第2期95-101,共7页 Journal of Light Industry
关键词 矩形纺丝箱 热-固耦合 热应力 约束 rectangular spinning box thermosetting-coupling thermal stress constraint
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