PCB阻焊表面异物附着原因分析及改善

Analysis and improvement of adhesion reason of PCB soldering surface foreign matter

随着集成度和产量不断提高,客户对PCB表观质量要求也越来越严格,其中阻焊油墨表面异物附着对产品性能及成品使用安全有着极大的重要性,这会导致PCB的制造成本增加。文章从人、机、物、法、环等方面考虑,充分展示产生问题的原因,避免遗漏,将每条原因分析到末端,以便直接采取对策实施改善,从而提高产品质量,降低公司成本及客户反馈率。

With the continuous improvement of integration and output, customers of PCB have more and more stringent requirements on the apparent quality of PCB, of which the adhesion of foreign matters on the surface of soldering ink is of great importance to the product performance and the safety of finished products, which will lead to the increase of PCB manufacturing cost. In this paper, human, machine, material, method, environment and other aspects are considered, in order to fully display the cause of the problem, to avoid omissions. Cause analysis is from the beginning to the end, so as to take direct measures to implement improvement, so as to improve product quality, reduce the company’s cost and customer feedback rate.