摘要
随着近年来客户端对PCB成品外观品质要求越来越高,越来越多客户对白色阻焊与化镀金板贴装通过高温无铅回流焊后,不允许白色阻焊层出现变色现象。文章对白色阻焊化镀金板回流后的变色问题原因进行层别分析及探讨,希望为同行带来参考价值。
In recent years, customer’s apparent quality requirement of PCB gets more and more restrict. White solder mask &ENIG board’s discoloration is not allowed after reflow in assembly process. This paper makes analysis of this issue and hope it will bring some available ideas for peers.
作者
肖建文
李海伟
石肇佟
Xiao Jianwen;Li Haiwei;Shi Zhaotong
出处
《印制电路信息》
2019年第5期13-16,共4页
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