摘要
文章研究了一种中粗化液,可促使铜面形成均匀的粗糙结构,既能有效增强铜面与干膜的结合力,又不会由于过度粗糙而影响信号传输,可适用于高频高密度线路的干膜前处理。
In this paper, a copper-roughening solution is studied, which can promote the formation of a uniform rough structure of the copper surface It can effectively enhance the binding force of the copper surface to the dry film without abating the signal transmission due to excessive roughness. It can be applied to the dry film pretreatment of high frequency circuits.
作者
侯阳高
马斯才
何康
杨泽
Hou Yanggao;Ma Sicai;He Kang;Yang Ze
出处
《印制电路信息》
2019年第5期24-28,共5页
Printed Circuit Information
关键词
表面处理
化学粗化
结合力
Surface Treatment
Roughening
Adhesion