龙门电镀线多镀层原因探究与预防

Research and prevention of multi-plating on gantry llating line

PCB制造过程中,通孔的镀层质量决定了PCB的可靠性,龙门电镀线在电镀过程出现多镀层会存在镀层断裂、结合力不足等品质隐患。针对龙门电镀线可能出现多镀层情况的原因进行探究与模拟,预防板件出现多镀层问题,提高金属化孔可靠性。

In the manufacturing process of PCB, the quality of plating through hole determines the reliability of the product. While in the electroplating process of the plating through hole, there might occur some potential problems such as cracking of the plating and poor adhesion strength. To tackle with the multi-plating of the of the gantry plating line, we need to explore and experience so that the problems can be avoided. And so as to develop the reliability of metallized holes.