多批次晶圆切换工时的计算及排序

Research on Makespan Calculation and Ranking of Multiple Wafer Batches Switching

随着晶圆制造趋于多品种、小批量的特点,组合设备运行时需要频繁地切换晶圆批次加工。为了提高组合设备的工作效率,研究单臂组合设备中晶圆批次切换工时的计算及排序问题。首先,基于改进的拉式调度策略,分析了单臂组合设备中连续两批晶圆加工的切换过程,并获得相应切换工时的计算表达式。其次,针对多批次晶圆的切换问题,建立了以最小切换总工时为目标的数学模型,并应用模拟退火算法求解近似最优的排序方案。最后,通过仿真实验验证了该方法的可行性和有效性。

Due to the trends of multi-varieties and smaller batch sizes in wafer manufacturing, cluster tools need to switch from processing one wafer batch to another frequently. To improve the efficiency of cluster tools, the scheduling problem that makespan calculation and ranking of wafer batches switching were addressed. Firstly, the switching process between two consecutive batches were analyzed in single-armed cluster tools based on the modified backward scheduling strategy. Then the corresponding closed-form expressions for makespan were derived. Secondly, a mathematical model for minimizing the total processing time of multiple wafer batches switching process was developed. Based on the mathematical model, an approximate optimal ranking scheme for multiple wafer batches switching were obtained by using simulated annealing. Finally, the simulation results showed the feasibility and validity of the proposed method.