3D-MCM高集成微波模块的热设计研究和应用

Thermal Design Research and Application of 3D-MCM Package Radar Microwave Components

文中针对3D-MCM高集成模块的散热问题,研究了3D-MCM组件在高能量密度、高集成度下的热设计,并以3D-MCM信号处理组件为例,根据信号处理组件电性能设计和封装布局设计要求,建立了参数化的有限元仿真模型。经过布局迭代、散热方式优化和组件材料优化,组件的等效热导率高达76 W/(m·K),封装基板局部的热导率可达183 W/(m·K)。基于氮化铝基板和纳米银等高导热材料,实现了高集成信号处理组件的高效散热设计。

Aiming at the heat dissipation problem of high integration signal processing module using 3D-MCM package, thermal design of 3D-MCM package components is studied under initial conditions of high energy density and high integration. Taking 3D-MCM package signal processing component as an example, a parameterized model is built according to initial electrical design and package layout design requirements of the signal processing component. After the design optimization of layout, cooling solution and material, the equivalent thermal conductivity of the 3D-MCM package component has been increased to 76 W/( m·K) and partial thermal conductivity of the package substrate has been increased to 183 W/( m·K). Heat dissipation design with high efficiency of high integration signal processing component has been realized based on package materials with high thermal conductivity, such as aluminium nitride substrate and nano-Ag.