集成电路的ESD防护关键技术分析

Analysis of ESD Protection Key Technologies for Integrated Circuits

随着消费者对集成电路要求的提高,芯片在生产过程中采用的工艺也不断得到改良提高,这对于改善提高芯片整体性能无疑具有关键作用和意义。但是在这个过程中,先进工艺也带来一定不良作用,其中比较明显的就是集成电路对芯片产生的静电放电的承受力有所下降,基于此,需要针对芯片的静电放电的防护技术进行强化。本文重点分析了当前集成电路中对静电放电防护的关键技术。

With the improvement of the demand of consumers for integrated circuits, the process adopted by the chip in the production process has been continuously improved and improved, which has no doubt played a key role in improving the overall performance of the chip. However, in this process, the advanced process also brings a certain negative effect. Among them, the tolerance of the electrostatic discharge generated by the integrated circuit to the chip has been reduced. Based on this, the protection technology for the electrostatic discharge of the chip needs to be strengthened. In this paper, the key technologies of electrostatic discharge protection in integrated circuits are analyzed.