键合球脱现象的调查分析及质量管控

Research on Ball Lift Phenomenon of Wire Bonding and Quality Control

随着消费类电子产品的普及,集成电路封装产能巨大,这对于封装代工厂来说,既是契机,也是挑战。目前先进封装技术发展迅速,但传统封装出货量仍占主要份额,特别是超声波球压焊技术仍占封装键合工艺的主流。本文主要针对球压焊工艺中出现的球脱现象进行调查分析,解决封装不良导致的测试失效及可靠性不良等问题,并从量产角度上提出质量管控方法。

With the popularization of consumer electronics,the capacity of IC package is enormous that it is not only a chance but a challenge for package factory. Advanced packaging is developing rapidly so far,but traditional packaging shipments still account for the main share,especially ultrasonic ball bonding remain the mainstream of wire bonding process. This paper mainly investigates and analyses the phenomenon of ball lift in the process of ball pressure welding,solves the problems of test failure and poor reliability caused by poor packaging,and puts forward the quality control method from the angle of mass production.