有铅与无铅元器件混装焊接工艺方法

Lead components and lead-free components mixed welding method

随着电子行业无铅化的迅速发展,部分器件生产厂商将有铅生产线改造成了无铅生产线,市场上无铅元器件迅速取代有铅元器件,由于有铅元器件和无铅元器件有着不同的焊接工艺,特别是BGA封装器件,因此需改变传统的生产工艺,以满足有铅元器件和无铅元器件混装的焊接工艺要求,通过分析,总结出有铅、无铅焊接工艺的本质区别。选择合适的焊料并调试既能满足有铅器件焊接又能兼顾无铅器件焊接的温度曲线,并通过高、低温和振动实验对混装焊接的产品质量进行验证,验证结果满足要求。

With the rapid development of lead-free electronics industry,part of the device manufacturers will lead the production line into a lead-free production line,lead-free components on the market quickly replace lead components.Due to lead components and lead-free components with different welding processes,especially BGA packages,so need to change the tradintional production process,in order to meet the welding process with mixed lead and lead-free components,through the analysis,summed up the lead,lead-free welding process essential difference,selecting the appropriate solder and debugging can satisfy the lead components welding and can take into account the temperature curve of lead-free welding,and the mixed welding quality is verified by the high and low temperature,vibration experiment,the results meet the requirements.