摘要
本文简述了铝垫裂纹潜在的危害。分析了铝垫裂纹产生的原因,研究了铜线键合过程中由于铜丝的固有特性对键合可靠性产生的负面影响[1]。阐述了改善铝垫裂纹的具体措施。对极易出现铝垫裂纹的产品实行特殊管控,通过一系列的硬件和软件改善措施,减少了铝垫裂纹问题造成的产品低良率、实现了产品由验证批次到风险批次再到量产批次的转化、由参数设置不当而导致铝垫裂纹的异常比例呈直线下降趋势、最终使产品的良率稳定达到99. 9%以上,符合生产与质量要求,达到了预期的目的。
This paper briefly describes the potential hazards of cracks in aluminium pads. The cause of cracks in aluminium cushion are analyzed, and the negative effects on bonding reliability due to the inherent characteristics of copper wire in bonding process are studied. The concrete measures to improve the crack of aluminium cushion are expounded. Through a series of hardware and software improvement measures, the products which are prone to cracks in aluminium cushion are specially controlled. The problem caused by cracks in aluminium cushion are reduced. The transformation of products from validation batch to risk batch and then to mass production batch is realized.The abnormal proportion of cracks in aluminium cushion caused by improper parameter setting shows a downward trend, and finally the yield of products reaches more than 99.9%, which meets the production and quality requirements and achieve the desired purpose.
作者
孟兴梅
MENG Xing-mei(TianshuiHuaTian Technology Co. Ltd., Tianshui 741000, China)
出处
《中国集成电路》
2019年第5期66-72,共7页
China lntegrated Circuit
关键词
铝垫裂纹
改善措施
特殊管控
crack of aluminium pad
improvement measures
special control