钨合金电化学腐蚀层性质的研究

Research on the Characteristics of Electrochemical Corrosion Layer of Tungsten Alloy

为了实现钨合金电解磨削加工过程中电化学作用和机械作用的平衡,通过碳酸钠溶液中钨合金电化学腐蚀试验,研究了钨合金表面在电化学作用下形成的腐蚀层的性质,以及电化学参数对腐蚀层的影响规律。试验结果表明,在选择性腐蚀作用下,钨合金中的硬质相钨颗粒被腐蚀溶解,留下一层由粘接相及其反应产物组成的多孔腐蚀层;电解液浓度、加工时间、加工电流和极间间隙等电化学参数对腐蚀层性质有显著的影响,通过调整电化学参数能够实现对腐蚀层厚度在20~100μm间的控制,研究结果可以为钨合金电解磨削过程中电化学参数的选择提供参考。

In order to achieve the balance between electrochemical and mechanical action in the tungsten alloy electrochemical grinding (ECG), the electrochemical corrosion experiments in Na 2CO 3 solution were conducted to study the characteristics of the forming corrosion layers under electrochemical action of tungsten alloy surface and the effect of electrochemical parameters on the corrosion layers. The results showed that under selective corrosion, hard tungsten particles was corroded and dissolved into the electrolyte and the generated porous corrosion layer was composed of the bonding phase and its reaction product. The electrochemical parameters such as electrolyte concentration, processing time, processing electric current, and inter-electrode gap had significant influence on the corrosion layers. By adjusting the electrochemical parameters, the thickness of the corrosion layer can be controlled from 20 μm to 100 μm, and the results can provide reference for the selection of electrochemical parameters in the tungsten alloy electrochemical grinding process.