“半胱氨酸亚金”配合物的置换化学镀金工艺

Immersion Electroless Gold Plating Technology of “Aurous-Cysteine” Complex

合成了一种半胱氨酸亚金的无氰、腈金化合物盐。以该亚金配合物为研究平台,开展了ENIG(化镍金)工艺研究。得到的最佳化学镀金工艺参数为:温度45~65℃,pH值1.5~2.5,亚金2.0~2.5 g/L,配体[Lig]10~25 g/L。在此条件下,可以获得晶粒细小均匀、结合力好的化学镀金层。

A cyanide-free aurous-cysteine compound salt was synthesized,and this aurous complex was used as a research platform to carry out the research on ENIG process.The optimal process parameters of electroless gold plating were determined as follows:temperature 45~65℃,pH value 1.5~2.5,aurous 2.0~2.5 g/L,ligand[Lig]10~25 g/L.Under these conditions,the obtained electroless gold coating was fine and uniform,and with good adhesion.