摘要
为满足人们对各种建材的高品质、高质量的需求,对相关的集成电路封装技术的要求也在日益提高。在集成电路封装技术中,导电胶作为一种具有一定导电性能的胶黏剂,在微电子封装、印刷电路板、在线键合、导电线路粘接等电子领域,得到了广泛的应用。本文对集成电路封装技术中导电胶的材料与性能进行研究,以提升导电胶的整体质量与性能,提高与之相关的产品的品质。
In order to meet people’s demand for high quality and high quality of all kinds of building materials, the requirements of integrated circuit packaging technology are also increasing. In integrated circuit packaging technology, conductive adhesive,as a adhesive with certain conductive properties, has been widely used in microelectronic packaging, printed circuit board, online bonding, bonding conductive lines and other electronic fields. In this paper, the materials and properties of conductive adhesive in integrated circuit packaging technology are studied to improve the overall quality and properties of conductive adhesive and the quality of related products.
出处
《中国建材科技》
2019年第2期41-42,共2页
China Building Materials Science & Technology
关键词
集成电路封装
导电胶
材料
性能
integrated circuit packaging
Conductive adhesive
materials
performance
