Sn-Bi系低温无铅钎料的研究现状与展望

Research status and prospect of Sn-Bi series low-temperature lead-free solder

锡铋钎料是近年来比较有发展潜力的低温无铅钎料,其广泛应用于低温钎焊相关产业中。锡铋钎料中Bi的脆性、 Sn-Bi钎料在服役过程中出现相的粗化以及Sn-Bi/Cu焊点Bi在界面偏聚等问题一直以来是国内外学者争相研究的热点。文中结合国内外对Sn-Bi钎料的最新研究成果,主要阐述了Ag, Cu, Zn, Sb, Ni等5个元素对Sn-Bi钎料的熔化特性、力学性能、润湿性以及钎焊点显微组织和性能等方面的影响,指明了不同成分的钎料在目前研究中存在的问题及今后研究的方向。

Tin-bismuth solder is a kind of low temperature lead-free solder with great prospective application in recent years. The brittleness of Bi in tin-bismuth solder, the coarsening of Sn-Bi solder phase during service and the interface bias of Bi element at Sn -Bi/Cu solder point have been the hot topics for scholars at home and abroad. Combined with the latest research results on Sn-Bi solder at home and abroad, in the paper, it is mainly discussed that the influence of Ag, Cu, Zn, Sb and Ni on the melting characteristics, mechanical properties, wettability, microstructure and properties of solder joints, and points out the problems existing in the current research and also outlooks the prospect of development trend in Sn-Bi solder.