摘要
为研究金属钎料与SiC陶瓷的界面结合方式,采用基于密度泛函理论的第一性原理方法,对Sn(001)/4H-SiC(0001)界面进行几何优化,得到优化后界面体系的结构,从分离功表征结合强度以及电子结构布居分析的角度解释界面结合本质和键合方式。结果表明:SiC陶瓷中C封端界面的分离功高于Si封端界面的分离功,Sn原子与C原子间形成的离子共价键在界面结合的成键中占有主要的地位。
In order to study the interface between filler metal and SiC ceramics, based on the first-principles method of density functional theory, the Sn (001)/4H-SiC(0001) interface is geometrically optimized to obtain the structure of the optimized interface system. The interface bonding nature and bonding mode are explained from the perspective of the binding strength of the separation work and the population analysis of the electronic structure. The results show that the separation work of the C-terminated interface in SiC ceramics is higher than the separation work at the Si-terminated interface. The ionic covalent bond formed between the Sn atom and the C atom plays a major role in the bonding of the interface.
作者
马志鹏
李昊宣
张茗瑄
许志武
MA Zhipeng;LI Haoxuan;ZHANG Mingxuan;XU Zhiwu(Department of Materials Science and Engineering,Northeast Petroleum University,Daqing 163318,China;State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China)
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2019年第3期17-20,共4页
Ordnance Material Science and Engineering
基金
国家自然科学基金(51674090)
关键词
SIC陶瓷
Sn基钎料
界面
电子结构
第一性原理
SiC ceramic
Sn-based solder
interface
electronic structure
first principles