微系统技术现状及发展综述

Overview of microsystem technology and its development

电力电子产品系统逐渐向小型化、高度集成化的方向发展,微系统汇集了多门学科技术的创新与突破,无论在军事还是民用领域已有广泛的应用。本文详述了国内外微系统技术的现状和发展趋势,其技术创新点在于多功能芯片一体化、智能传感、异质集成、堆叠式系统级封装技术的突破和新型半导体材料的应用;文末总结了微系统技术发展的意义,并提出展望。

The power electronic product system is developing to miniaturization and high integration gradually. Microsystems bring together innovations and breakthroughs in multiple categories of technology, and have been widely used in military and civilian fields. In this paper, the present situation and development trend of microsystem technology in China and abroad are described. Its technological innovation lies in the breakthrough of multi-functional chip integration, intelligent sensing, heterogeneous integration, stacked system-level packaging technology and the application of new semiconductor materials. At the end, the significance of the development of microsystem technology is summarized and the prospect is put forward.