LTCC基板缺陷分析及改善对策

Defect analysis and improvement measures of LTCC substrate

针对低温共烧陶瓷(LTCC)基板生产过程中遇到的对位偏差缺陷问题,从材料、工艺、设备、环境条件等多个方面做了详细的分析和验证。排除了打孔误差、印刷误差、叠片误差等非关键性影响因素,确定了导致偏差的根本原因是生瓷片变形所致的开腔误差以及打孔机的累积误差。提出了通过控制环境温湿度、缩短加工周期来减小生瓷片变形量以及对错位区域进行补偿的措施,解决了产品的缺陷问题,提高了产品的合格率,产品一次合格率达到95%。

For the contraposition deviation problems in the low temperature co-fired ceramic (LTCC) substrate, detailed analysis and verification were made from material, process, equipment and environmental condition. The analysis exclude the non- critical factors such as punching, printing and lamination error. It was determined that the deviation was caused by the piercing position error due to the deformation of raw ceramic chip and the accumulative error of punching machine. Some measures were put forward to solve the defect problems and improve the yield of the product, such as controlling the ambient temperature and humidity, shortening processing time to reduce the deformation of raw ceramic chip and compensating the dislocation area. The throughput yield of the products can reach 95%.