辅助络合剂对无氰电镀Cu-Zn合金的影响

Effect of Auxiliary Complexing Agent on Cyanide Free Electroplating Cu-Zn Alloy

本文以沉积电流密度、电流效率、光泽度以及镀层表面形貌等为评价指标,研究了六种辅助络合剂对酒石酸钾钠体系电镀Cu-Zn合金的影响。结果表明,六种络合剂均可扩展沉积电流密度上、下限,其中草酸钾和乳酸对酒石酸钾钠体系电镀Cu-Zn合金的影响最为明显,前者明显改善电流效率及镀层光泽度,后者明显扩展沉积电流密度上、下限。二者浓度为30g/L时,均可获得整平性较好的Cu-Zn合金镀层。

In this paper,the influence of six kinds of assistant complexing agent on the deposited Cu-Zn alloy in sodium potassium tartrate system were studied based on the deposition current density,current efficiency,gloss and microscopic surface morphology of the coating. The results showed that the six assistant complexing agents could extend the upper and lower limits of deposition current density of Cu-Zn alloy. Among the six agents,potassium oxalate and lactic acid showed the most obvious effect on the electroplating of Cu-Zn alloy in sodium potassium tartrate system. The potassium oxalate could improve the current efficiency and gloss of the alloy,and the lactic acid could expand the limit of deposition current density obviously. The Cu-Zn alloys with the smooth morphology could be obtained when the concentration of potassium oxalate and lactic acid is 30 g/L respectively.