摘要
GPP二极管的广泛应用和激光切割技术的发展,促使采用激光划片机切割GPP二极管芯片成为最佳加工方式。提出一种激光划片设备中激光控制器的设计,该控制器采用STM8系列单片机设计实现;该控制器功能强大,运行稳定可靠,很好地保证了激光划片设备的正常运行。
With the wide use of GPP diodes and the development of laser cutting technology,have promoted using the Laser Dicing Saw becoming the best way to dice the GPP wafer.This paper prompts a method of design the laser module controller,which bases on the MCU of STM8.The controller is powerful and reliable,which guarantees normal operation of the equipment.
作者
彭华东
宋波
PENG Huadong;SONG Bo(The 26^th Research Institute of CETC,Chongqing 400060,China;The 45^th Research Institute of CETC,Beijing 100176)
出处
《电子工业专用设备》
2019年第3期60-62,共3页
Equipment for Electronic Products Manufacturing
关键词
激光器
激光控制器
单片机
接口
Laser
Laser controller
MCU(Micro controller unit)
Interface
