HDI开铜窗的一种激光加工方法

A laser processing method for removing copper cover by HDI

当前的HDI板盲孔加工工艺需要先进行湿制程的黑化或者棕化处理表层铜,再由CO2激光钻孔机进行钻孔加工。本文提出一个加工方法,使用UV激光进行开铜窗,然后再用CO2加工盲孔,激光加工路径采用渐变螺旋线路径进行加工,可以更好地保证开铜窗后的孔底质量。

The current HDI board blind hole processing process requires blackening or browning of the surface layer copper in the wet process, and the following drilling by the CO2 laser drilling machine. In this paper, a processing method is introduced that use UV lasers to open copper windows and then use CO2 to process blind holes. The laser processing path is processed by a gradual spiral path, which can better guarantee the quality of the bottom of the hole after opening the copper window.