摘要
棕化工艺用于提高多层板的粘结力,内层铜面经棕化后能使半固化片和铜面的粘结力得以提升,尤其是该棕化液含有两种特别成分SB和THF,这两种特殊的成分能增大氧化膜面积和粘结力。本文阐述了该棕化药液的性能、工艺要求和品质改进措施。
Brown oxide are used to enhance bonding strength in multilayer circuit board. After inner layer copper surface is oxidized in the brown oxide solution, the surface area is enhanced so that the bonding strength is increased between prepreg and cuprous clad. Especially, two special kinds of components, which are SB and THF in this brown oxide solution can increase oxide film acreage to enhance bonding strength. This text elaborates the functions and process of the brown oxide solution.
作者
陈冠刚
程静
麦东厂
郭文
Chen Guangang;Chen Jing;Mai Dongchang;Guo Wen
出处
《印制电路信息》
2019年第6期19-24,共6页
Printed Circuit Information
关键词
棕化
聚席夫碱
席夫碱
剥离强度
缓蚀率
Brown Oxide
PSB
Poly-Schiff Base
SB
Schiff Base
Peel Strength
Inhibition Rate