高频高速PCB多模块子板埋置工艺研究

Study on embedding technology of multi-module sub-board in high frequency and high speed PCB

文章通过制作多模块间内层互连工艺、双面嵌子板和内埋子板结构的高频高速局部混压PCB,研究双面嵌子板混压模块间内层导通、内埋子板的可行性与工艺能力提升方法,其中包括埋子板平整度、对准度、耐热可靠性、内层导通线路制作能力、线路剥离强度的测试与分析。结果表明,工艺具备较高的可行性,可靠性符合要求。

In this paper, by manufacturing the high frequency inner layer interconnection, the double-sided embedded board and the buried sub-board structure PCB, it makes research of the feasibility and process capability of inner layer conduction and internal buried board between double-sided embedded board Lifting methods, which include buried plate flatness, alignment, heat resistance reliability, inner layer conduction line fabrication energy,test and analysis of force and line peel strength. The results show that the process has high feasibility, and the reliability meets the requirements.