摘要
综述了聚酰亚胺材料在智能制造领域的应用进展以及未来发展趋势。从智能制造技术的特征及其对新材料的应用需求、适用于智能制造技术的聚酰亚胺新材料的开发以及该材料在智能制造技术中的典型应用等方面进行了阐述,着重介绍了3D增材制造领域用负性光敏型聚酰亚胺以及热塑性聚酰亚胺材料的研究及应用进展。
The recent applications and future developing trends of polyimides(PI)in intelligent manufacturing(IM)fields were summarized.Several aspects,including the characteristics of IM techniques and their property demands on the new materials;the research and development(R&D)status for novel PI materials applicable for IM fabrication;and the typical applications of PIs in IM fields were mainly presented.Particularly,R&D conditions for PI materials applicable for 3D additive manufacturing(AM),including negative photosensitive PIs(PSPI)and thermoplastic PIs(TPI)were emphatically introduced.
作者
张燕
职欣心
武晓
郭晨雨
毕洪生
刘金刚
Zhang Yan;Zhi Xinxin;Wu Xiao;Guo Chenyu;Bi Hongsheng;Liu Jingang(School of Materials Science and Technology,China University of Geosciences,Beijing 100083)
出处
《化工新型材料》
CAS
CSCD
北大核心
2019年第5期1-4,共4页
New Chemical Materials
基金
中国地质大学(北京)基本科研业务费(53200759028)
北京高等学校高水平人才交叉培养"实培计划"项目
关键词
聚酰亚胺
智能制造
3D打印
光敏型聚酰亚胺
热塑性聚酰亚胺
polyimide
intelligent manufacturing
3D printing
photosensitive polyimide
thermoplastic polyimide
