摘要
大容量数据存储在高可靠性、高密度、低成本等的现实上存在技术瓶颈,针对此问题,3D封装作为一种有效方案被提出。从陶瓷封装技术的角度出发,探讨一种大容量存储器电路的高可靠堆叠封装方法,以陶瓷双面两腔外壳完成存储器芯片的3D封装。提出热匹配特性控制、多芯片堆叠和低弧度引线键合技术。对大容量存储芯片3D封装的可靠性设计、关键工艺技术、典型故障模式、故障机理和解决方案等展开研究,以提高存储器的可靠性、环境适应性和空间存储效率。实验证明,以此法完成封装的单一电路的存储容量达到世界一流水平,满足国内外新兴产业及高可靠性领域使用需求。
Large-capacity data storage has technical bottlenecks in realizing high reliability,high density,low cost,etc.As a effective solution,3D packaging is proposed.From the perspective of ceramic packaging technology,a highly reliable stacking packaging method for mass storage circuits is discussed.The 3D packaging of memory chips is completed with ceramic double-sided and two-cavity housings.Thermal matching characteristic control,multi-chip stacking and low radian wire bonding technologies are proposed.The reliability design,key process technology,typical failure modes,failure mechanism and solutions of mass storage chip 3D packaging are studied to improve the reliability,environmental adaptability and space storage efficiency of the memory.Experiments show that the storage capacity of a single circuit packaged by this method reaches the world-class level,meeting the requirements of emerging industries and high reliability fields at home and abroad.
作者
刘笛
LIU Di(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China)
出处
《微处理机》
2019年第3期7-10,共4页
Microprocessors