真空溶渗Cu-Cr50触头研磨工艺研究

Research on Grinding Process of Vacuum Infiltration Cu-Cr50 Contact

触头作为真空灭弧室的关键零件,其性能好坏对真空灭弧室的综合性能有着重要的影响.为了提高触头的耐压值,采用试验的方法研究了真空溶渗Cu-Cr50触头研磨工艺对触头表面粗糙度、形貌、平面度的影响,分析了不同研磨工艺下的极限工频耐压变化值.实验结果表明,在此次试验的研磨时间内,研磨能够降低触头表面粗糙度,改善触头表面形貌,对平面度没有影响.随着研磨时间的增加,粗糙度会逐渐降低,到一定程度后基本不再变化.通过研磨工艺可有效的提高真空灭弧室的极限工频耐压值,降低导电回路的电阻值.

In order to improve the permissible voltage values of the contacts, the influence of the grinding process of the vacuum infiltration Cu-Cr50 contacts on the surface roughness, morphology and flatness of the contacts was studied, and the variation of the ultimate working frequency permissible voltage value of different grinding processes was analyzed. The results indicate that the grinding can decrease the surface roughness of the contact and improve the morphology of the contact surface with no effect on the flatness. With the increase of grinding time, the roughness is decreased gradually, and it would almost no longer change when it reaches a certain extent. By grinding process, ultimate working frequency permissible voltage value can be improved effectively, and the resistance value of the conductive loop can be decreased.