管式炉中半导体激光器巴条封装

Packaging of Semiconductor Laser Bars in Tube Furnace

采用808nm大功率半导体激光器巴条进行了封装实验,对影响封装质量的两个重要因素,即管炉温度和烧结时间进行了优化。结果表明,在管炉温度为650℃、烧结时间为100s时,焊料层界面空洞最少,半导体激光器巴条的smile效应值最低,阈值电流最小,波长更加稳定,烧结质量最优。

The 808 nm high-power semiconductor laser bars are used for packaging to optimize the two important factors that affect the package quality: the furnace tube temperature and the soldering time. The results show that the solder layer has the least voids when the soldering time is 100 s at a tube furnace temperature of 650 ℃. Moreover, the obtained semiconductor laser bar has the lowest smile effect value, the smallest threshold current, a more stable wavelength, and the best soldering quality.