Delamination strength of HTS tape under transverse tensile stress and its enhancement by using different Ag layer depositing temperatures

For the application of second generation high temperature superconducting coated conductors (CCs) with layered structures, thermal mismatch between different components and electromagnetic force exerted in superconducting layer in a working magnet can cause transverse tensile stress, which would result in delamination behavior. Therefore many research groups have designed experiments to measure the delamination strength and dedicate to improving that. However, the reason of the discrete distribution of measured data has still not get quantitatively studied, besides, there are lack of investigations on the method of changing depositing conditions to improve the delamination strength except by adding an additional metal layer. In this work, we adopt an anvil test device and obtain delamination strengths as 29.6 MPa of YBa2Cu3O7-x (YBCO)/buffer and 114.6 MPa of buffer/substrate by combing energy disperse spectroscopy (EDS) detection. The reason of discretized measurement data on the delamination strength is explained. Moreover, we find that different temperatures during Ag deposition determine the bonding force of Ag and YBCO layer. The Delamination strength between Ag and YBCO layer increases from 4.4 MPa to larger than 114.6 MPa with temperature elevated from 30℃ to 100℃. Hence we present a novel method for improving the delamination strength of YBCO CCs by setting an optimal temperature of Ag deposition.

For the application of second generation high temperature superconducting coated conductors(CCs) with layered structures, thermal mismatch between different components and electromagnetic force exerted in superconducting layer in a working magnet can cause transverse tensile stress, which would result in delamination behavior. Therefore many research groups have designed experiments to measure the delamination strength and dedicate to improving that.However, the reason of the discrete distribution of measured data has still not get quantitatively studied, besides, there are lack of investigations on the method of changing depositing conditions to improve the delamination strength except by adding an additional metal layer. In this work, we adopt an anvil test device and obtain delamination strengths as 29.6 MPa of YBa2 Cu3 O7-x(YBCO)/buffer and 114.6 MPa of buffer/substrate by combing energy disperse spectroscopy(EDS)detection. The reason of discretized measurement data on the delamination strength is explained.Moreover, we find that different temperatures during Ag deposition determine the bonding force of Ag and YBCO layer. The Delamination strength between Ag and YBCO layer increases from 4.4 MPa to larger than 114.6 MPa with temperature elevated from 30 °C to 100 °C. Hence we present a novel method for improving the delamination strength of YBCO CCs by setting an optimal temperature of Ag deposition.