珀尔帖电流引线界面漏热特性分析

Analysis of interfacial heat-leakage characteristics of peltier current lead

对应用在超导直流装置中的珀尔帖电流引线在有限元仿真软件COMSOL中建模,以最小漏热为目标对珀尔帖电流引线进行了优化设计。在确定了珀尔帖电流引线最优几何参数后,对珀尔帖电流引线在不同电流值时轴向的温度分布、漏热值、热电元件低温端温度值以及两端的温度差、热电元件两端的电势差等进行了定性分析。在最优模型的基础上,建立了考虑焊接材料时的仿真模型,分别分析了热电元件碲化铋和铜块之间焊接材料(焊锡、铟和银)对珀尔帖电流引线漏热和热电元件碲化铋低温端温度值的影响。由仿真结果分析可以得到,在热电元件碲化铋和铜块之间焊接材料(焊锡、铟和银)使珀尔帖电流引线的漏热增加了,但增量是比较小的。

Peltier current lead(PCL) used in the superconducting DC device was modeled in the finite element simulation software COMSOL, and PCL was optimized with the minimum heat leakage as the target. After determining the optimal geometric parameters of PCL, the axial temperature distribution, the heat leakage, the temperature at low temperature end of Bi2Te3 and the voltage between two ends of Bi2Te3 of PCL at different current values were qualitatively analyzed. Based on the optimal model, a simulation model of PCL considering the soldering material was established. The heat leakage of PCL and the temperature value at low temperature end of the thermoelectric element Bi2Te3 affected by adding solder materials(solder, indium and silver) between the thermoelectric element Bi2Te3 and copper were analyzed. It can be obtained from the simulation results that the heat leakage of PCL is increased while adding the soldering material(solder, indium and silver) between the thermoelectric element Bi2Te3and copper block, but the increment is very small.