基于玻璃-硅复合基板的微系统圆片级三维封装

Microsystem Wafer-level 3D Packaging Based on Composite Glass-Silicon Substrate

随着微系统追求更小的尺寸、更高的集成度,圆片级三维封装技术已成为未来微系统封装的发展趋势。基于玻璃回流工艺,提出了一种新型圆片级三维封装技术。设计了用于实现单模光纤阵列与玻璃基板上平面光波导之间耦合封装的U型槽阵列,采用高导硅作为垂直电引出,制备了玻璃-硅复合基板,并用玻璃帽实现了封装。玻璃-硅复合基板技术在三维微系统和光电子封装领域中具有重要的应用前景。

With the pursuit of smaller size and higher integration of microsystems, wafer-level 3 D packaging technology has been the trend of microsystem packaging. In this paper, a new wafer-level 3 D packaging technology based on glass reflow process is proposed. U-groove array for coupling and packaging of single mode fiber array and planar lightwave circuit on glass substrate is designed. Using highly-conductive Silicon as vertical electrical feedthroughs, Glass-Silicon composite substrate is fabricated, and the packaging is then realized by a glass cap. Glass-Silicon composite substrate technology shows great potential for 3 D microsystem and optoelectronic packaging.