高强高导Cu-Cr-Ti合金加工工艺设计与优化

Process Design and Optimization of High Strength and High onductivity Cu-Cr-Ti Alloy

通过采用上引连铸、冷拉拔、固溶和时效新工艺制备高强高导Cu-Cr-Ti/Cu-Cr合金杆,利用金相显微镜、扫描电子显微镜、透射电子显微镜研究各工艺处理后Cu-Cr-Ti合金的微观组织演变规律;通过维氏硬度计和涡流电导率仪测量合金的维氏硬度和电导率。结果表明,随着时效时间的增加,抗拉强度先增加后降低,电导率先增加后趋于不变,Cu-Cr-Ti/Cu-Cr的最佳工艺为450℃时效60min后冷拉拔至Φ=3mm,抗拉强度分别达到584MPa、526MPa,电导率分别达到63.7%IACS、83.1%IACS、抗软化温度分别为507.4℃、557.3℃,Ti元素的添加可以抑制合金的再结晶晶粒长大及影响第二相的形貌。

The Cu-Cr-Ti/Cu-Cr alloy rod with high strength and high conductivity was prepared by continuous up-casting, cold drawing, solid solution and aging new process. The microstructure evolution of Cu-Cr-Ti alloy after various processes was studied by metallographic microscope, scanning electron microscope and transmission electron microscope;The Vickers hardness and electrical conductivity of the alloy were measured by Vickers hardness tester and eddy current conductivity meter. The results show that with the increase of aging time, reduce after tensile strength increase first, conductivity after the first increase tends to be constant, the best technology of Cu-Cr- Ti/Cu - Cr is 450 ℃ aging 60 min after cold drawing to Φ= 3 mm, tensile strength reached 584 MPa and 526 MPa, conductivity 63.7% IACS, 83.1% IACS, resistance to softening temperature 507.4 ℃, 557.3 ℃ respectively,. The addition of Ti element can inhibit the recrystallization grain growth of alloy and the effect of second phase morphology.